Instrument Cluster - Handling of Printed Circuit Boards
Group 62Instruments
Bulletin Number
62 01 89 (1803)
Woodcliff Lake, NJ
January 1989
Technical Dept.
SUBJECT:
Handling of Instrument Cluster Printed Circuit Boards
MODELS:
All
Situation:
A large number of instrument cluster printed circuit boards are found to be damaged when they are received in the Warranty Parts Return Center.
In most cases, this can be traced to improper handling/shipping procedures.
Handling/ Shipping Procedures:
These procedures must be followed during the handling and shipping of the printed circuit boards.
^ Disassemble cluster using the Static Protection Kit outlined in S.I. 04 30 87 (1546).
^ Do not touch the circuit board with your bare hands; use the black plastic bag that the replacement board is shipped in.
^ Return defective boards only in the original packing that the replacement board was sent in.
^ Store boards in a dry location and out of temperature extremes.
Warranty Information:
Claims will be refused if
^ boards are not packaged as described above;
^ claim description does not include sufficient description of defect. "Defective Board" is not acceptable.